Plak kouvèti devan (Pati No . 251708371) pou chajè XCMG
Materyèl de baz: Fwad -woule fèy asye (SPCC/DC01) ak 2.0±0.1mm epesè, konfòme ak estanda JIS G 3141 oswa EN 10130.
Tretman andigman: Electro-galvanize kouch (5-8μm) ki te swiv pa epoksidik-polyester kouch poud (60-80μm), reyalize pi gwo pase oswa egal a 500 èdtan net rezistans espre sèl.
Pwopriyete mekanik:
Fòs rupture: 270-350 MPa
Dite: 50-55 HRB
Rezistans move tan: UV-estabilize kouch pou kenbe tèt ak -40 degre a +150 degre tanperati opere.
Dimansyon tolerans: ± 0.3mm plat, ak pre-twou aliye komanse fouye (Φ12±0.2mm).
Pwodwi Deatials
| Non Pati | Front Cover Panel | Nimewo Pati | 251708371 |
| Modèl | 300FV(TD).5.10.1-1 | Aplikasyon | XCMG loader |
| Gwosè pake | / | GW | 25.5KG |
| MOQ | 1 PC | Non mak | CBP |
Baj popilè: 251708371 panèl kouvèti devan pou chajè xcmg, Lachin 251708371 panèl kouvèti devan pou manifaktirè loader xcmg, faktori




